Influence of activation of Si29+ ion-implantation in GaAs on ohmic contact resistance and electrical performances of MESFETs

Abstract

The active layers of Metal Semiconductor Field Effect Transistors (MESFETs) are obtained by Si29+ ion implantation in GaAs. Implantation was done at 35 keV with a higher dose near the wafer surface for facilitating easier formation of ohmic contacts, and at 180 keV with a lower dose for obtaining the device channel. Post-implantation annealing was carried out in a rapid thermal processor for activating the implants. Very high activation levels of about 60% for the n+ GaAs layer, and 85% for the n-GaAs channel layer were achieved by annealing at 955 °C for 25 s. Activation was characterized using C–V profiling, secondary ion mass spectrometry and by electrical device data of fabricated MESFETs. We attempt an experimental correlation between the ohmic contact resistance (R c) and activation of both the n+ and the channel layer. It was found that very high and simultaneous activation of the n+ and channel layers results in very low contact resistances. The conduction of source-drain current into the channel is easily facilitated due to reduction in the resistance of the transition region at the interface of n+-contact and n-channel layers.