Abstract
The influence of Activated Carbon (AC) particles on mechanical properties of Sn-Cu-Ni-xAC solder joint was investigated. Five different Activated Carbon (AC) percentage addition (0 wt. %, 0.25 wt. %, 0.5 wt. %, 0.75 wt. %, and 1.0 wt. %) were prepared via powder metallurgy (PM) technique. Interfacial IMC thickness measurement and shear strength results showed that with thinner IMC layer (by increasing amount of wt.% of AC), the higher the shear strength of the joint. It is believed that the AC particles suppresses the interfacial IMC growth and thus improves the shear strength.
Highlights
The eutectic Sn-0.7Cu solder alloy has been used as one of the candidates to replace the traditional Sn-Pb solder
Some attractive and potentially available methods of enhancing solder joint performances are by adding reinforcements to solder alloys, to form composite solders [4]
Sn-Cu-Ni powder alloys were mixed with different weight percentage (0, 0.25, 0.5, 0.75 and 1.0 wt. % ) of the Activated Carbon in an airtight container using a roller blender rotated at a speed of 200 rpm for 1 hour
Summary
The eutectic Sn-0.7Cu solder alloy has been used as one of the candidates to replace the traditional Sn-Pb solder. Solder with improved mechanical properties have to be developed to suit with rapid advance in the electronics industry. By these reasons, many researchers investigate and develop a solder material to meet the requirement of the modern solder. Some attractive and potentially available methods of enhancing solder joint performances are by adding reinforcements to solder alloys, to form composite solders [4]. Other ceramic reinforcing material such as Si3N4 has been studied by Ramli et al [6] and Mohd Salleh et al [7] They reported that the mechanical properties of the composite solder have improved significantly. The intermetallic compound layers are formed due to an interfacial reaction between solder alloy and metal substrate. The intermetallic compound and shear strength of the composite solder joint were investigated
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