Abstract
A quantificational approach was proposed to analyze the discrepancy of monocrystalline silicon surface roughness along different crystal orientations in diamond turning on Statistical Product and Service Solutions software. This work aimed to understand how crystal orientation affects surface generation in the cutting behavior of monocrystalline silicon. In this study, the measured surface roughness data were first processed in advance to eliminate some adverse effects of outliers. The average values of surface roughness distributions were obtained. The surface roughness values of different measurement directions were compared, and the influences of crystal orientations on surface roughness were analyzed. Results indicate that the crystal orientation and the cutting parameters have much influence on machined surface roughness. Finding some special crystal orientations using Euclidean distance analysis with average analysis is effective. The vibration induced by crystallographic orientation is the main reason to make surface nonuniform roughness in single-point diamond turning. This finding is verified by analyzing the surface generation mechanism.
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