Abstract
Based on epoxy resin, Aradur9506 as curing agent and Flake silver powders, isotropic conductive adhesives(ICA) were prepared, The effects of the functional groups of epoxy resin and the addition of curing agent in isothermal cure on the resistivity of the ECA were investigated by FT-IR method, scanning electron microscopy（SEM）and other means. The results indicated that tensile shear strength declined with the increased in the number of epoxy functional groups and raised with the addition of curing agent, and the tensile shear strength was inverse relationship with the curing shrinkage
Full Text 
Sign-in/Register to access full text options
Sign-in/Register to access full text options 
Published version (
Free)
Free) 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a call
