Abstract
The oxidation behavior and mechanism of Ti-Cu alloys (0≤w(Cu)≤20%) in the temperature range of 1000°C~1300°C are studied by thermogravimetric analysis(TGA) combined with SEM, EDS and XRD analysis methods. The results show that the oxidation rates of Ti-Cu alloys increase sharply when the temperature rises above 1000°C. The oxidation products have a three-layer structure, from the outside to the inside, which are dense outer oxide layer of TiO2, porous inner oxide layer of low valence oxide of Ti and Cu-enriched layer. With the increase of the temperature, the thicknesses of oxide layers of Ti-Cu alloy increase and the Cu-enriched phase increases gradually and melts. The melting Cu-enriched phase flows to the oxidation surface along the grain boundaries of the oxide layer. The high temperature oxidation resistance of Ti-Cu alloys declines with the increase of Cu content. The main reason is that more liquid Cu-enriched phase is formed and flows to the oxidation surface along the oxide grain boundaries in the Ti-Cu alloy, and Ti and O ions can diffuse more easily along the liquid Cu-enriched phase, which increases the oxidation rates.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have