Abstract
The objective of this work is to briefly illustrate the breadth of problems industrial technology computer aided design (TCAD) departments are expected to address when supporting modern semiconductor process development, focusing on two important trends. The first is the incredible expansion of the simulation domain both downward to atomic dimensions and upward to the very large-scale die-level simulations needed for product design. The second trend is the continuing necessity of using computational efficient continuum approaches, fortified with more physically rigorous methods, to meet both accuracy and wall-clock time requirements of industrial process development. Both of these trends will be illustrated with applications work done at Intel.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
