Abstract
This paper presents an adaptive fuzzy control algorithm for the control of the solder paste stencil printing stage of surface mount printed circuit board (PCB) assembly. The proposed method of automatic solder paste stencil printing consists of four blocks: fuzzy feature extraction, defect classification of paste deposits, adaptive fuzzy rule-based model identification and subsequently an optimal control action for the stencil printing process. Experimental results are presented to illustrate the capability of the algorithm.
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