Abstract
The process of induction heating for the formation of solder ball leads of solder pastes on the contact pads of printed circuit board is investigated. The application of annular inductors with internal ferrite magnetic core has allowed us to concentrate magnetic field lines in the working zone and ensure an optimum temperature profile of heating at a rate of 40–50°C/s while assembling BGA packages.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.