Abstract
The effect of indole, IN, and 5-chloroindole, Cl-IN, on the anodic dissolution of copper in acidic sodium chloride solutions was studied using voltammetry on a rotating disc electrode (RDE). Both compounds used at 10−3 M concentration act as strong inhibitors on the copper dissolution, but indole exhibits better inhibiting properties. The inhibitory action substantially increases with decreasing solution pH. The influence of these organic additives on the electrodeposition of copper on platinum was also investigated using RDE and electrochemical quartz crystal microbalance (EQCM) techniques. The EQCM measurements show that a sparingly soluble layer of the inhibitor is responsible for the protective effects observed in chloride solutions.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
