Abstract
We have designed and developed an indigenous ultra high vacuum (UHV) sputtering system which can deposit magnetic thin films with high purity and good uniformity. The equipment consists of state-of the-art technologies and sophistication. Turbo-molecular pump combined with sputter ion pump is used to pump down the vacuum chamber up to 10−10 to 10−11 mbar of pressure. With this system it is possible to deposit coatings of various materials on a sample size of diameter 3". The Ni81Fe19 ferromagnetic thin films, with Tantalum (Ta) as a buffer and cap layers have been deposited on silicon substrates using this ultra high vacuum (UHV) sputtering system. The magneto transport measurement study indicated a significant variation in the AMR values of the films for varying thicknesses of tantalum and NiFe layers.
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