Abstract

In the present study, nanoindentation studies of the 95.8Sn-3.5Ag-0.7Cu lead-free solder were conducted over a range of maximum loads from 20mN to 100mN, under a constant ramp rate of 0.05s−1. The indentation scale dependence of hardness was investigated. The results revealed that the hardness is dependent on the indentation depth. As the maximum holding load increased, which corresponded to an increasing indentation depth, a decreasing trend in the hardness was observed.

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