Abstract
In recent years, nanocrystalline materials have attracted much attention in materials research because they behave differently from conventional materials. For example, the nanocrystalline materials exhibit enhanced mechanical properties, such as high strength and hardness. The present study was performed to investigate the indentation creep mechanism of nanocrystalline Cu-TiC alloys which were prepared by HIP (Hot Isostatic Press) processing of MA (Mechanical Alloying) powders and hot rolling afterwards. As these materials have high densities and high structural stability, the authors could investigate creep behavior at wide temperature ranges below 0.5Tm (Tm is the melting temperature of copper).
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