Abstract
In the present study the microstructure changes and their impacts on creep parameters from the indentation creep testing are investigated. For this propose the alloys Sn-5Sb-1.5Ag (SSA) plain solder and SSA reinforced with ZnO nanoparticles composite solder have been fabricated. The specimens were isothermally aged at 125, 175 °C for 24 h, and then quenched in air at 27 °C. The microstructure of the present solders is identified by X-ray diffraction (XRD). A crystalline β-Sn and intermetallic compounds (IMCs) SnSb and Ag3Sn are detected. Microstructural evolutions revealed refinement of SnSb and Ag3Sn IMCs as a result of ZnO addition. The reinforcing ZnO nanoparticeles are found to decrease the creep strain. The calculated values of the stress exponent n for the indentation creep process are found to decrease with increasing aging temperature. The value of n of the composite solder was found less than that of the plain solder at the same testing conditions.
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