Abstract
The experimental variation of the microhardness of lead with dwell time and temperature is reported. At homologous temperatures close to 0.5T m, and using low loads (i.e. 0.1 N), a period of zero indentation creep of the order of 300 sec is observed. This phenomenon, called the incubation period, and the subsequent indentation creep behaviour, are explained in terms of restructuring and recovery of the dislocation network beneath the indenter.
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