Increased Capacitance Density with Metal-Insulator-Metal - Metal Finger Capacitor (MIM-MFC)

Abstract

Capacitors are indispensable in mixed signal and RF applications. In mixed signal applications, capacitors and inductors often take up a very large space on the chip as compared to the digital portion of the circuit. In this paper we propose a new configuration of metal-insulator-metal - metal finger capacitor (MIM-MFC) to increase capacitance density. This capacitor is designed to be area effective, thus it is an attractive choice for mixed signal and RF applications. The capacitors were fabricated using Silterra Malaysia's 180 nm RF CMOS process technology. This paper also provides low frequency characterization measurement data for MIM-MFC. Analysis is made as compared to pure MIM and pure MFC that were fabricated on identical process and measured on the same wafer.