Abstract
The effects of incorporation of nano-CuO into phenol formaldehyde (PF) resin during sythesis on curing kinetics, nano-CuO structure and bond quality were investigated on orientated strand board (OSB). Apparent activation energy of the PF resins modified with CuO was decreased during the reaction indicating an acceleration of both addition and condensation reactions. X-ray diffraction data indicated that the Cu was in a bivalent state. Morphological analysis confirmed that CuO was uniformly dispersed at both nano and micro scales. Addition of nano-CuO to PF resin was associated with significantly higher internal bond strength on OSB panels. The results suggest that nano-CuO enhances the properties of conventional PF resin to imporve panel properties.
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