Abstract
Nickel–titanium thin films were deposited onto silicon substrates and subjected to incomplete martensitic transformations . With wafer curvature methods, we observed a stress discontinuity that seems analogous to the splitting of the endothermic peaks measured by differential scanning calorimetry due to the temperature memory effect. The martensite start temperature ( M s ) remains constant during incomplete forward transformations, resulting in a constant-stress range between the arrest temperature and M s . However, incomplete reverse transformations start immediately at the arrest temperature. X-ray diffraction measurements confirm these path-dependent behaviors, which are consistent with the thermodynamic model of martensitic transformations.
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