Abstract
High intensity, surface cooled incoherent UV wavelength selective excimer radiation sources have recently become available for industrial applications. These unique lamps are particularly suited for industrial adhesive and film curing. A new bimolecular sensitizer-initiator compound was developed to be used with the 222 nm excimer lamp for enhancing curing rates of resin formulations. The new dielectric excimer lamp will be discussed together with the new photoinitiator chemistry. Comparative curing rate data showing values greater than five-fold increases over conventional UV lamps and photoinitiator systems along with cure depth and concentration effects are reported.
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