In‐situ void formation technique using an AlN shell structure grown on GaN stripes on Si(111) and c‐plane sapphire substrates

Abstract

AbstractWe proposed an in‐situ void formation technique using high‐temperature AlN growth on GaN stripes in order to reduce residual stress. Microcracks were observed during the growth of AlN; the GaN stripes then sublimated from the microcracks while keeping the AlN shell, resulting in void formation in the AlN shell structure. After GaN regrowth on this AlN shell structure, we successfully coalesced the GaN stripes to form a smooth, thick GaN layer having voids at the GaN/substrate interface. Raman spectroscopy confirmed that the residual tensile stress was decreased. The thermal stress decreased owing to the separation between the GaN layer and a foreign substrate. (© 2012 WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim)