Abstract
The Cu–Sn metallurgical soldering reaction in two-segmented Cu–Sn nanowires is studied by in situ transmission electron microscopy. By varying the relative lengths of Cu and Sn segments, we show that the metallurgical reaction results in a Cu–Sn solid solution for small Sn/Cu length ratio while Cu–Sn intermetallic compounds (IMCs) for larger Sn/Cu length ratios. Upon heating the nanowires to ∼500 °C, two phase transformation pathways occur, η-Cu6Sn5 → e-Cu3Sn → δ-Cu41Sn11 for nanowires with a long Cu segment and η-Cu6Sn5 → e-Cu3Sn → γ-Cu3Sn with a short Cu segment. The evolution of Kirkendall voids in the nanowires demonstrates that Cu diffuses faster than Sn in IMCs. Void growth results in the nanowire breakage that shuts off the inter-diffusion of Cu and Sn and thus leads to changes in the phase transformation pathway in the IMCs.
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