Abstract
We synthesize, in situ, W-x wt% Cu (x = 5, 10, and 20 wt%) composite nanoparticles using inductively coupled radio-frequency (RF) thermal plasma. In the RF thermal plasma process, the W-x wt% Cu composite nanoparticles are synthesized by hydrogen reduction of tungsten trioxide (WO3) and cupric oxide (CuO). The synthesized W and Cu nanoparticles are effectively reduced to W and Cu, and the W-Cu nanoparticles are uniformly distributed bimetallic (or composite) nanoparticles.
Highlights
W-Cu composites provide excellent performances in thermal/electrical management, offering high strength, high-temperature resistance, and other advantages [1–3]
WO3 and cupric oxide (CuO) micro-powders were selected as precursors to synthesize the W and Cu nanoparticles due to the low melting temperatures
WO3 and CuO have much lower boiling points (WO3, 1973 K; CuO, 2273 K) than those of W (5828 K) and Cu (2835 K); this means that the fed micro-powders are more vaporized through the RF thermal plasma process (30 kW induction plasma system; Tekna, Quebec, Canada) compared to pure W and Cu metal powders
Summary
W-Cu composites provide excellent performances in thermal/electrical management, offering high strength, high-temperature resistance, and other advantages [1–3]. The excellent physical properties of W-Cu composite present a high potential for use in automotive, aerospace, electric power, and electronic industries [4, 5]. Certain physical properties of W and Cu impede the fabrication of W-Cu composite materials. The major issue in the fabrication process originates from the melting temperature of W and Cu. W has very high melting temperature (Tm) of 3683 K with a low thermal expansion coefficient; Cu melts at 1353 K but offers high thermal/electrical conductivity. The huge difference between Tm (W) and Tm (Cu) makes hard to fabricate W-Cu composite materials. W-Cu has no mutual solubility and high contact angle, so W-Cu-based composites, in general, have difficulty achieving full densification by liquid-phase sintering [6]. W-x wt% Cu with x < 20 wt% is used for electrical/thermal management, such as in electric circuits
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