Abstract
In situ study of the effect of Nitrate on the Electrochemical migration of Tin under Chloridecontaining Thin Electrolyte Layer
Highlights
Electrochemical migration (ECM), which is a form of corrosion, significantly compromises the corrosion reliability of electronic devices [1,2,3]
Failure time increased sharply when the nitrate concentration was increased from 10 mM to 50 mM but fluctuated at about 20 s with low nitrate concentrations (1–5 mM)
Failure time decreased from 1617 s to 81 s at 100 mM nitrate and further decreased to 16 s at 200 mM nitrate. This result suggests that the slowest growth rate of dendrites was achieved at medium nitrate concentrations
Summary
Electrochemical migration (ECM), which is a form of corrosion, significantly compromises the corrosion reliability of electronic devices [1,2,3]. Lead-free tin-based solders, which commonly consist of almost 95% tin, are widely used for surface finish on printed circuit board assemblies or other electronic packages [6]. Given their significant roles in electronic devices, tin and its alloys have been extensively studied for their ECM. Previous studies focused on ECM test methods [7,8], ECM influencing factors (alloy elements [9,10,11,12], solution chemistry [13,14,15], steady and unsteady state electric fields [16,17]), tin dendrite morphology [18,20], and ECM mechanism [1,3]
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