Abstract
Rapid solidification technology has been successfully adopted for the preparation of in-situ nanoparticulate-reinforced Sn–Ag composite solder. The applied rapid solidification process promotes nucleation and suppresses the growth of intermetallic compounds (IMCs) of Ag3Sn during the eutectic solidification, yielding fine Ag3Sn nanoparticulates with spherical morphology in the solidified solder structures. Those spherical, homogeneously-distributed nanoparticulates IMCs are benefit to improve the surface area per unit volume and obstruct the dislocation lines passing through the solder. Hence, this in-situ nanoparticulate-reinforced Sn–Ag composite exhibits higher microhardness.
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