Abstract
Dynamic in situ fracture experiments were performed on SiC-whisker-reinforced Al203 to determine the mechanisms responsible for the observed increase in fracture resistance. Observations of both stationary as well as moving crack tips while the specimen was under load showed that fracture resistance is due to debonding near the whisker matrix interface, crack deflection, pinning, and bridging by SiC whiskers.Two types of hot pressed specimens were evaluated. One contained 20 vol % SiC whiskers as well as 0.5 wt % MgO and 2.0 wt % Y203 as sintering aids. Another was fabricated with only 5 vol % SiC whiskers with no sintering aids. Specimens were prepared for TEM by cutting the material perpendicular to the hot pressing axis, grinding, polishing, dimpling, and argon ion milling.
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