In situ formation mechanism of the honeycomb structure of a vitrified-bond diamond composite

Abstract

Vitrified-bond diamond composites are materials commonly used for grinding wheels in the grinding process of silicon wafer production. In this study, the mechanism of the in situ honeycomb structure formation in the sintering process of composite materials was explored by changing the binder content without adding a pore-forming agent.The results show when the content of vitrified bond is 55 wt%, the in situ honeycomb structure forms, resulting in a porosity of 60.68 % and bending strength of 23.03 MPa.The X-ray diffraction (XRD), Raman spectroscopy (RS), and thermogravimetry-differential thermal analysis (TG-DTA) results show that no graphitization of diamond grain occurs during sintering. The bonding ability between the vitrified bond and diamond grain, along with the microstructure of vitrified-bond diamond composites, was studied using scanning electron microscopy (SEM). Moreover, the results of energy spectrum analysis (EDS) show that the diffusion and segregation of Na at the interface between the diamond particles and the vitrified bond improve the bonding strength, and the vitrified bond can effectively bond with the diamond particles. Finally, the formation mechanism of the honeycomb structure was elucidated using the surface and interface sintering theory.