In Situ Construction of the Fe-Cu Hydroxide Interlocking Structure with Solution-Derived Cu/Ag Current Collectors for Flexible Symmetric Supercapacitors.

Abstract

The current collector serves as a crucial element in supercapacitors, acting as a medium between the electrode material and the substrate. Due to its excellent conductivity, a metal collector is typically favored. Enhancing the binding strength between the collector and the substrate as well as between the collector and the electrode material has emerged as a critical factor for enhancing the capacitance performance. In this study, a Ag film with a grass root-like structure was initially grown on a PI substrate through the surface modification and ion exchange (SMIE) process. This Ag interlocking structure contributes to strong binding between the PI substrate and Ag without compromising the mechanical properties of the Ag film. To further enhance the electrochemical properties at low scan rates, electroless-plated Cu was subsequently deposited on the Ag film to form the Cu/Ag current collector. Moreover, the Cu within the Cu/Ag current collector served as a precursor for the growth of FeOOH-Cu(OH)2 via a two-step in situ method. The resulting FeOOH-Cu(OH)2/Cu/Ag structure as a whole is binder-free. Supercapacitors employing symmetric FeOOH-Cu(OH)2/Cu/Ag structures were assembled, and their energy storage properties were investigated. The solution-based low-temperature process used in this study offers the potential for cost-effective and large-scale applications.