In situ cleavage prepared bilayer graphene device and its large magnetoresistance

Abstract

A Zn-based in situ cleavage method is applied to fabricate few-layer graphene devices. This approach avoids unintentional electron-beam irradiation damage, in addition to creating a series of clean graphene devices with well controlled layer numbers. As prepared bilayer graphene surprisingly achieves a magnetoresistance ratio as high as 350% at 1.9 K and 100% at room temperature. For this reason, in situ cleavage method/electron-beam lithographic could provide a more effective way to fabricate modern day carbon electronic components.