Abstract
In this study, electrodeposition of Pb on polycrystalline Cu surface has been investigated by cyclic voltammetry (CV). Simultaneous in real time ellipsometry (SE) have been performed to study the characterization and morphological evolution of the Pb layer. The results demonstrated that the rate at which deposition thickness is increasing is going up and revealed that thin Pb deposition layer has already acquired at all the polarization process. So the Cu substrate is not optically ignored during the total polarization process.
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