Abstract
SUMMARYTemperature profiling has been used for basic thermal cure quality assurance purposes n the finishing industry for years'3. The following paper aims to review the use and benefits of such a technique not only for finishing QA but also process control, optimisation and proactive fault finding. Detailed discussion will be given to the changing requirements of such a technique and the innovative developments in data collection, interpretation and reporting being implemented to take the technique into the new millennium. An introduction will be given to new portable units working directly from hand held Palm PDA devices.
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