In-Plane Residual Stress Map for Solar PV Module: A Unified Approach Accounting the Manufacturing Process

Abstract

The photovoltaic (PV) cell fracture reduces the efficiency of solar PV modules and the residual stresses generated in the silicon cells by various stages of manufacturing process are attributed as one of the primary reasons among others. In this study, a unified approach to investigate the residual stresses present across the PV module owing to differing material properties and thermal cycles during manufacturing process is attempted. In particular, an in-plane residual stress map for different layers of solar PV module and the stress jump across the layered structure arisen during the manufacturing process are quantified through finite element method by considering ethylene vinyl acetate encapsulant as a linear viscoelastic material. The maximum residual stress presence in the cell is observed during the encapsulant curing cycle of lamination process. The predictions on the stress pattern and magnitudes from the simulations collaborate well with the experimental observations reported in literature.