Abstract
In this research tannic acid was used to prepare soy-based adhesives for making plywood and fiber board. The different resin formulations were analyzed by Differential scanning calorimetry (DSC), thermogravimetric analysis (TGA) and its derivative as a function of temperature (DTG) and Fourier Transform Infra-red (FTIR) spectroscopy. The results showed that the addition of tannic acid to soy-based adhesive decreased soy-based adhesive viscosity and its pH. The DSC analysis showed that the denaturation temperature of soy-based adhesives decrease by adding tannic acid. The TGA and DTG curves showed that the thermal degradation of soy flour starts above 146 °C. The FTIR spectroscopy results also showed that the soy flour amino acids appeared to react well with tannic acid. Furthermore, delamination and shear strength test results showed the good water resistance of plywood bonded with soy-based tannic acid-modified adhesive. The mechanical and physical properties such as MOR, MOE, IB, and water resistance of fiberboard were improved, by adding tannic acid to the soy-based adhesive.
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