Abstract

Thermal engineers face a lot of challenges in converting heat with low heat dissipation rate. This idea led me to read and analyse the heat pipe in various forms. “Heat pipes” are used in various mechanical and electronic devices. A small improvement in the “heat pipe design” will result in a drastic change. Can reduce the heat dissipation rate. Many factors affect the “efficiency of the heat pipe”. This includes the geometric design, the number of evaporators and capacitors, the working liquid characters, the application of different coatings, the adhesive and the combined forces. A “wick system model” can be created in CATIA (a 3D modelling software). Different heat transfer properties can be determined using “CFD analysis” by changing different types of wick materials. CFD analysis will analyse the best and most effective material with pressure drop, “heat transfer rate and temperature variation” with measured values.

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