Abstract

The rapid progress of electronic devices like electric vehicles, smartphones, and IoT systems has fueled the demand for compact, high-performance batteries. However, a critical challenge arises from heat accumulation within these devices, leading to malfunctions and reduced efficiency. To address this, efficient heat dissipation is crucial, with thermal interface materials (TIMs) widely used for heat transfer. While polymers are favored for TIMs due to their ease of processing and electrical insulation, their low thermal conductivity poses limitations. In this study, a solution is proposed by chemically grafting boron nitride (BN), a ceramic-based filler, onto carbon fiber (CF) surfaces. This BN-g-CF hybrid filler, formed through a reaction between acyl chlorides and amine groups, exhibits superior compatibility with polymer matrix. Characterization confirms successful treatment, and thermal conductivity measurements show a remarkable enhancement, positioning the BN-g-CF/epoxy resin composite as a promising solution for efficient thermal management in various electronic industries.

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