Improving the thermal and mechanical properties of epoxy resins for electronic packaging

Abstract

An epoxy resin with liquid crystal aromatic esters of epoxy resin (TPBDER) used as modifier of epoxy resin was synthesized form 4-Hydroxy benzoic acid, 4,4'-Dihydroxydiphenyl, epichlorohydrin(ECH). Epoxy resin (ER) was modified by TPBDER for improving both thermal and mechanical properties of electronic packaging materials. The TPBDER modified epoxy was cured with amino-teminated polyoxypropylene D230 and isophorone diamine(IPDA). The thermal properties, liquid crystalline properties of the cured materials were studied by dynamic mechanical analysis(DMA) and differential scanning calorimetry (DSC). The effects of TPBDER loading on dynamic mechanical properties and thermal conductivity of the resins were examined. The results show that TPBDER crystal transition exists near the temperature between 150 °C and 170 °C. The TPBDER/ER demonstrated goodmechanical and thermal properties. When the loaded TPBDER was 30(wt)%, the thermal conductivity was 0.36W/m.K, is maximally 3 times higher than that of conventional epoxy resins(0.18 W/m.K).