Improving the mechanical properties of carbon nanotube-reinforced pure copper matrix composites by spark plasma sintering and hot rolling

Abstract

The poor dispersion of carbon nanotubes (CNTs) in a copper matrix and the weak interfacial bonding between CNTs and the Cu matrix critically hinders the engineering applications of their composites. Herein, we obtained a well-dispersed and tight interfacial bonding between CNTs and Cu matrix in the Cu/CNTs composites fabricated via spark plasma sintering and subsequently hot rolling. Microstructural characterization shows that the small grain size of Cu matrix, the uniform dispersion of CNTs, and the good wettability and interfacial bonding between the CNTs and Cu significantly improved the mechanical properties of the Cu/CNTs composite. This work provides an innovative fabrication process for the development of high performance Cu/CNTs composites with excellent interfacial bonding strength.