Abstract
As the temperature of electronic devices increases, their failure rate increases. That is why electrical devices should be cooled. One of the promising cooling techniques is using Phase Change Materials (PCMs). A new passive temperature management technique, that involves the direct placement of PCMs on the chip, has been explored and developed. PCMs are potential temperature regulators that can store thermal energy and release it during melting and freezing respectively. PCM-based heat sinks can efficiently store the heat dissipated from the electronic components to delay the peak temperature of the electronic devices as much as possible and then release the stored energy during the off period. This paper compares the temperature distribution on a heat sink with and without PCM with different magnitudes of heat flux. Also, two different PCMs with different densities, namely salt-hydrate and wax, have been investigated in cooling electronic devices.
Highlights
Modern life is deeply interconnected with electronic equipment, from toys and appliances to high-power computers
The heat generated by the electronic is transferred and The thenheat the generated heat is carried by the chip surrounding air by convection
Because we are usually limited in the volume of the heat sink, a Phase Change Materials (PCMs) with high density lead to a larger mass transfer from solid to liquid and vice versa
Summary
Modern life is deeply interconnected with electronic equipment, from toys and appliances to high-power computers. Paraffin waxes as PCMs do possess the disadvantage of a lower thermal lower corrosion rates to metals and negligible sub-cooling with no phase segregation. Such characteristics conductivity, volume expansion during melting-freezing up tochange. High-density borax problems with salt hydrates as temperature regulators are their lower thermal stability, chemical may settleand down when added. It should be noted thattoPCMs need to re-solidify that is, they needsuch to dissipate systems are only applicable to devices that have rest periods and not to those with continuous the heat gained to the surroundings while the device is off [11] Only applicable to devices that have rest periods and not to those with continuous operation
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