Abstract
Cryogenic Power Electronics (CPE) provides promising benefits for power conditioning system compared to their room-temperature counterparts in terms of reduced size and weight (increased power density), improved efficiency, improved switching speed, and improved reliability. Active devices such as semiconductor switches can exhibit performance improvements such as reduced conduction losses, higher switching speed, reduced diode reverse recovery, greater device gain, higher over-current capability, and increased power levels. Passive devices (inductors, capacitors, interconnects) will also improve by the lowered resistance of their constituent metal conductors or the use of superconductors. This paper aims to review the present status of CPE and to provide an outlook on emerging device technologies that are gaining in interest. Advanced power electronic packaging/interconnect methods that adapt well to cryogenics and help further improve system performance is discussed. Given improved and known device and interconnect properties, the system designer can develop the best circuit topologies for maximum CPE system performance.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
