Abstract
Improving the insulation layer’s thermal conductivity is a key technology when concerning conquering the bottleneck of electronic device development. For improving the insulation layer’s thermal conductivity on the surface of aluminum alloy substrates, anodizing and MAO technology had been combined to prepare thick compact crystalline alumina ceramic. In addition, the influence of current density on the coating performances had been studied. Then, results showed that after plasma discharge treatment, amorphous alumina with thickness reaching 143 µm had been transformed into crystalline alumina and the through holes were sealed. The influence of current density on the crystallinity, compactness, and adhesion of the coating had been studied, and results showed as the current density increased from 10 mA/cm2 to 50 mA/cm2, the crystallinity of the coating increased and the compactness of the coating decreased. Moreover, when the current density was lower than 30 mA/cm2, the coating had good adhesion to the substrate. The impedance, breakdown voltage, and thermal conductivity of the coating were observed for comparison with those of the anodic coating. Then from the results, it was found that after the coating had been treated with this method, the impedance increased from 60 kΩ/cm2 to 120 kΩ/cm2, while the breakdown voltage increased from 0.89 kV to 3.24 kV as the thermal conductivity increased from 10.2 W/m K to 23.7 W/m K.
Highlights
When it comes to power electronic device technology, a relatively high voltage, large current, great power density, and small size have become the main trend
The impedance, breakdown voltage, and thermal conductivity of the coating were observed for comparison with those of the anodic coating
From the results, it was found that after the coating had been treated with this method, the impedance increased from 60 kΩ/cm2 to 120 kΩ/cm2, while the breakdown voltage increased from 0.89 kV to 3.24 kV as the thermal conductivity increased from 10.2 W/m K to 23.7 W/m K
Summary
When it comes to power electronic device technology, a relatively high voltage, large current, great power density, and small size have become the main trend. When the current is conducted, a great amount of Joule heat may be generated by a power electronic device. Device normal functionality relies on the heat dissipation by insulating a ceramic substrate. It highlights the necessity to rationally design and produce the substrate material featuring high thermal conductivity and reliability.. The aluminum alloy is widely employed in the electronic industry to prepare heat sinks due to its high strength, good thermal conductivity, and decorative performance.. To guarantee the normal operation of electronic devices, the heat sink should have excellent insulation and thermal conductivity. It highlights the necessity to rationally design and produce the substrate material featuring high thermal conductivity and reliability. The aluminum alloy is widely employed in the electronic industry to prepare heat sinks due to its high strength, good thermal conductivity, and decorative performance. To guarantee the normal operation of electronic devices, the heat sink should have excellent insulation and thermal conductivity.
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