Abstract
This work presents theoretical and experimental analysis of a new loop thermosyphon, which evaporator has a flat box shape, manufactured by diffusion bonding, designed to promote passive thermal control of avionics. Transient start-up and steady state conditions were considered in this study. The thermal performance of the device was experimentally accessed, with special attention to the Geyser Boiling phenomenon, which is undesirable for aeronautics applications. The phenomenon was eliminated by covering one of the evaporator internal walls by a wick structure. An electrical circuit analogy model was proposed to estimate the overall thermal resistance and the temperature distribution, which depends of the thermal load position in the evaporator external wall. Theoretical predictions were compared favorably with wicked evaporator.
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