Abstract

Industrial growth has led to increased electronic component integration, resulting in higher working temperatures and technological failures. Cryogen spray cooling (CSC) could reach cryogenic temperatures with fast-responding, but its heat transfer limitation due to liquid film deposition is potentially challenging. In this study, CSC cooling is incorporated with either a cold air jet (CAJ) or a sweeping jet (SWJ) to enhance heat and fluid flow. A K-type thermocouple is used for measuring the surface temperature, while the improved Duhamel theorem is used to estimate the heat flux. The spray and film intensities are recorded through the Mie-scattering methodology via high-speed camera. The results demonstrated that the CAJ/SWJ exhibited a significant reduction in surface temperature and film intensity, enhanced heat dissipation and spray efficiency compared to CSC cooling. More precisely, it demonstrated a 26%–36% heat transfer coefficient improvement, along with a 52% increase in the corresponding time of the critical heat flux. Meanwhile, the CAJ/SWJ intensifies heat transfer during film and transition boiling, inspired by the fast liquid film evaporations. In contrast, the SWJ is much preferred due to its wider and stable coolant coverage throughout film evaporation, as seen by its greater heat transfer coefficient. The combined results demonstrated the need to promptly eliminate the deposited film, as it holds the potential to serve as a pivotal resolution for the advancement of thermal management technology.

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