Abstract
Improving cathode morphology at a copper electrowinning plant by optimizing Magnafloc 333 and chloride concentrations
Highlights
Copper cathode quality is of great importance because it is sold in its as-stripped state
In the past guar was the most commonly used additive in copper electrowinning, because of its compatibility with solvent extraction (Davenport et al, 2011)
Ridd, and Sheehan (2006) studied the effect of activated polyacrylamide on the surface morphology of electrodeposited copper and found that the surface roughness with a diluted electrolyte was statistically lower than when the additive was either prepared in water, in full-strength electrolyte, or in alkaline solutions
Summary
Copper cathode quality is of great importance because it is sold in its as-stripped state Organic additives, such as Magnafloc 333, are added to the electrowinning circuit to ensure a smooth plated surface. In the past guar was the most commonly used additive in copper electrowinning, because of its compatibility with solvent extraction (Davenport et al, 2011). It has been used as a levelling agent for more than 40 years to produce good quality copper cathodes (Cui, 2014). Magnafloc 333 is a very high molecular mass non-ionic polyacrylamide flocculant that undergoes hydrolysis in acid or alkaline solutions, but is stable under neutral conditions (Caulfield, 2002). Fabian, Ridd, and Sheehan (2006) studied the effect of activated polyacrylamide on the surface morphology of electrodeposited copper and found that the surface roughness with a diluted electrolyte was statistically lower than when the additive was either prepared in water, in full-strength electrolyte, or in alkaline solutions
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