Improving bonding strength of medium-thick Al-Cu dissimilar joint by a novel splat cooling assisted double side friction stir welding

Abstract

To obtain a high-strength medium-thick Al-Cu dissimilar joint, a novel splat cooling assisted double side friction stir welding (SDS-FSW) is proposed. The microstructure and tensile properties of conventional double-side friction stir welding (DS-FSW) and the novel SDS-FSW joints under optimal welding parameters are systematically compared, it shows that the utilization of in-process splat cooling significantly reduces the welding peak temperature and the high-temperature dwell time. The in-process splat cooling causes significant grain refinement in the welding nugget zone (WNZ) of the Al-Cu dissimilar SDS-FSWed joint, it exists the lower recrystallization fraction and the higher KAM value. Although both DS-FSW and SDS-FSW joints fracture at the Al-Cu interface, the DS-FSW joint represents a brittle fracture characteristic, while the SDS-FSW joint represents a mixed ductile-brittle fracture mode. Under the drive of the mechanical stirring of the tool and the welding thermal cycle, the aluminium atoms and copper atoms diffuse to the copper base material and aluminium base material, respectively. Since copper diffuses in aluminium at a higher diffusion rate than aluminium diffuses in copper, and the solubility of copper in aluminium is much smaller than that of aluminium in copper, thus the Al2Cu becomes the first phase with the nucleation and growth. As the welding temperature and time continue to increase, Al2Cu reaches the supersaturation state, and the Al4Cu9 phase is produced between the Cu (Al) and the Al2Cu phase. In the end, the interface forms the stable double-layer IMCs structure (Al2Cu/Al4Cu9). The optimal tensile strength of the SDS-FSWed joint is 159 MPa, which is increased by 42% compared to the DS-FSWed joint at the same welding parameter. This was mainly because in-process splat cooling contributed to forming a thinner IMCs layer at the A-Al-Cu interface. It reveals that the application of in-process splat cooling is a versatile method to thin the IMCs layer at the Al-Cu medium-thick DS-FSW process.