Abstract

The changes in atomic-layer-deposited HfO2 films on Si and Si1−xGex (x=0.1, 0.2, and 0.3) substrates by postdeposition annealing were studied. The migration of Ge reduced the capacitance equivalent thickness while keeping the leakage current density almost invariant after annealing. High resolution x-ray photoelectron spectroscopy and secondary ion mass spectroscopy analyses confirmed that Ge atoms which had diffused into the HfO2 layer during the deposition were drawn back to the substrate by annealing which was accompanied by the decrease in the interfacial strain energy. A very low interface trap density (1.3×1010cm−2eV−1) was obtained when x=0.3.

Talk to us

Join us for a 30 min session where you can share your feedback and ask us any queries you have

Schedule a call

Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.