Abstract
The peeling behavior of a thin film bonded to a substrate is investigated by using the cohesive interface model. We compare the peeling processes of film/substrate interfaces with three different geometric shapes, including a flat interface, a curved interface of sinusoidal shape, and a wavy interface with two-level sinusoidal hierarchy. The effect of the peeling angle on the maximal peeling strength is also examined. It is demonstrated that the peeling strength can be significantly improved by introducing a hierarchical wavy morphology at the film/substrate interface. This study may be helpful for the design of film/substrate systems with enhanced mechanical properties.
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