Abstract
The enhancement in strength is generally attended by ductility loss in lead-free solder alloys, which is commonly denoted as strength-ductility trade-off (SDT). This work provides new viewpoint on the design of novel Sn–0.7Cu–0.2Ni (SCN) solders with the notably enhanced SDT, possessing yield stress (YS) of 40.8 MPa, tensile strength (UTS) of 42.9 MPa, and large uniform elongation up to 240%. Such breaking between competing properties of SDT is caused by microstructural modification that comprised with the arrangement of fine and coarse-sized phases in complex heterogeneous microstructures. Toward this end, the heterogeneous structures in SCN solder are produced by Al-microalloying, followed by cold-drawn and temperature-annealing. However, microalloying of 0.1% Al decreases the undercooling of SCN solder while 0.2% Al reduces the eutectic temperature. Our results show that the heterogeneous structure design strategy can offer a new generation of enhanced SDT alloys with boosting elastic compliance and plastic energy chock resistance for mobile products industry.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callMore From: Journal of Materials Science: Materials in Electronics
Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
