Abstract
This work addresses the solderability and the reliability of n-type IBC ZEBRA cells with screen printed copper paste busbars. Improvement of the solderability by Sn60Pb40 solder alloy coated PV ribbon using an industrial automated IR stringer is reported. For qualification of the module reliability, climate chamber thermal cycling (TC) and damp heat tests (DH) were performed on mini modules with variations in material combinations: low temperature silver and copper pastes, each of them demanding dedicated soldering process parameters and two different encapsulation materials: polyolefin elastomers (POE) and ethylene vinyl acetate (EVA). All tested modules passed 3 x IEC TC and 2 x IEC DH, while the modules with EVA encapsulant passed DH 3000 as well. The copper paste metallized modules with EVA encapsulant showed no degradation in pseudo fill factor (pFF) and open circuit voltage (VOC), proving the statement that no copper diffuses into the silicon bulk.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
