Improvement of sensitivity of ultrasonic beam induced resistance change (SOBIRCH) method with ultrasound resonance in mold resin

Takuto Matsui,Shigeru Eura,Kosuke Tatsumi,Naohiro Hozumi,Toru Matsumoto,Tomohiro Kawashima,Yoshinobu Murakami

doi:10.1109/ipfa47161.2019.8984890

Improvement of sensitivity of ultrasonic beam induced resistance change (SOBIRCH) method with ultrasound resonance in mold resin

Takuto Matsui, Shigeru Eura + Show 5 more

https://doi.org/10.1109/ipfa47161.2019.8984890

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Publication Date: Jul 1, 2019

Citations: 6

Affiliation: Toyohashi University of Technology, Hamamatsu Photonics (Japan)

#Failure Analysis Of Semiconductor Devices #Resistance Change Method + Show 8 more

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Abstract

In some cases of failure analysis of semiconductor devices, package state analysis without mold decapsulation is required. The ultrasonic beam induced resistance change (SOBIRCH) method has been proposed to carry out the analysis without decapsulation. In the previous research, it was suggested by numerical simulation that ultrasonic resonance in mold resin improves the sensitivity of the SOBIRCH. In this report, the sensitivity improvement with ultrasound resonance was verified experimentally.

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