Abstract

In order to improve the electrical performance of resistive random access memory (RRAM), sulfur (S)-doping technology for HfOx-based RRAM is systematically investigated in this paper. HfOx films with different S-doping contents are achieved by atmospheric pressure chemical vapor deposition (APCVD) under a series of preparation temperatures. The effect of S on crystallinity, surface topography, element composition of HfOx thin films and resistive switching (RS) performance of HfOx-based devices are discussed. Compared with an undoped device, the VSET/VRESET of the S-doped device with optimal S content (~1.66 At.%) is reduced, and the compliance current (Icc) is limited from 1 mA to 100 μA. Moreover, it also has high uniformity of resistance and voltage, stable endurance, good retention characteristics, fast response speed (SET 6.25 μs/RESET 7.50 μs) and low energy consumption (SET 9.08 nJ/RESET 6.72 nJ). Based on X-ray photoelectron spectroscopy (XPS) data and fitting of the high/low resistance state (HRS/LRS) conduction behavior, a switching mechanism is considered to explain the formation and rupture of conductive filaments (CFs) composed of oxygen vacancies in undoped and S-doped HfOx-based devices. Doping by sulfur is proposed to introduce the appropriate concentration oxygen vacancies into HfOx film and suppress the random formation of CFs in HfOx-based device, and thus improve the performance of the TiN/HfOx/ITO device.

Highlights

  • Resistive random access memory (RRAM), as the emerging non-volatile memory, has the potential to replace traditional NAND flash [1,2,3]

  • The electrical forming process and the 10 continuous I–V cycles of each device are shown in Figure S1 of the Supplementary Materials

  • The Icc of the D3 device can be limited at 100 μA, as shown in Figure 2b, and the VSET/VRESET of D3 is +0.11 V/−0.15 V, which will contribute to a low power property

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Summary

Introduction

Resistive random access memory (RRAM), as the emerging non-volatile memory, has the potential to replace traditional NAND flash [1,2,3]. It is still difficult to comprehensively improve device performances; for example, its low energy consumption and high cycle-to-cycle uniformity.

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