Abstract
Pb-based solders are used as high-temperature solders in power semiconductor devices. Although the use of Pb is globally restricted, alternative materials cannot replace the Pb-based solder. This study proposes that the Pb-based solder can be replaced by Zn-Sn alloys. Die shear tests revealed that some Zn-Sn solder joints between Cu substrates had a higher shear strength between 300 K and 543 K than those between Fe-42Ni substrates. The microstructure of the Zn-Sn solder joints between Cu substrates showed network microstructures consisting of a Zn phase and e-CuZn5 phase and direct connection between the network microstructures and intermetallic compound layer. These morphologies of the high melting phase should improve the shear strength even at the elevated temperature of 543 K.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
