Abstract
In this study, the influence of HF treatment of Ag pastes after a firing process was investigated. It was shown that the HF treatment can improve the fill factors and efficiencies of various cells including those with high initial specific contact resistances. SEM images showed that this improvement is due to the etching of the thin glass layer at the Ag-Si boundary, which exposes the Ag crystallites and colloids. These colloids electrically connect the bulk Ag to the Si through a direct contact, which reduces both the transfer length and the specific contact resistance. A model of the current path was proposed to explain the effect of HF treatment on the edge of the Ag grid.
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